The Technical Programme Committee is inviting papers related, but not limited to, the following areas:

  • Sample Preparation, Metrology and Defect Characterization
  • Die-Level / Package / System-Level Failure Analysis Case Studies
  • Advanced Fault Isolation Techniques
  • Advanced Physical Failure Analysis Techniques
  • Front-End of Line ( FEOL ) Reliability
  • Back-End of Line ( BEOL ) Reliability
  • Package-Level Reliability
  • Non-Volatile Memory ( NVM ) and Non-Silicon Device Reliability

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Please refer to the IPFA2017 abstract template.            

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