IPFA 2017

Submission Deadline: Extended to March 17,2017

The 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits ( IPFA 2017 ) is organized by the IEEE Reliability / CPMT / ED Singapore Chapter, IEEE Electron Devices Society Chengdu Chapter and the University of Electronic Science and Technology of China ( UESTC ) . The Symposium is technically co-sponsored by the IEEE Electron Device Society and IEEE Reliability Society.


IPFA 2017 will be devoted to the fundamental understanding of the physical mechanisms governing failure in a large variety of advanced semiconductor devices and the electrical - physical failure analysis techniques, methodologies and tools that could be use to reliably identify the root cause of failure in these devices. The Technical Programme Committee is inviting papers related, but not limited to, the following areas:


• Sample Preparation, Metrology and Defect


• Die-Level / Package / System-Level Failure Analysis

   Case Studies

• Advanced Fault Isolation Techniques

• Advanced Physical Failure Analysis Techniques

• Front-End of Line ( FEOL ) Reliability

• Back-End of Line ( BEOL ) Reliability

• Package-Level Reliability

• Non-Volatile Memory ( NVM ) and Non-Silicon Device Reliability




Prospective authors are requested to submit a two-page(at least) summary ( includes text and figures ) of their previously unpublished and original research work.

The summary section of the submission should present the content of the submission according to the following sub-headings:

1 Brief introduction to the background and motivation/ objectives of the work.

2 Experimental results, analysis and discussion.

3 Summary of the findings, highlighting their impact, novelty and importance.

4 Supporting figures, tables, and references.


All submissions must be in English. The materials in the paper must be original and unpublished. Please submit the abstract according to the provided template and the abstract length is required to be at least 2pages. Only electronic submission in PDF format will be acceptable.

Please limit your submission file size to 2 MB and submit your abstract through the IPFA Website http://www.IPFA2017.com by 17 March 2017, from which the provided template can be downloaded as well. For further details please contact the Technical Program Chair.


Authors of papers that have been accepted for presentation will be notified by 7 April 2017. Upon notification of acceptance, authors will be asked to submit a final manuscript (to be submitted by 3 June 2017) such that it can be published in the Symposium Proceedings and presented at the symposium.



February 24th  March 17th,2017                                         Submission of Summary and Abstract

March 24th April 7th,2017                                                   Notification of Paper Acceptance

May 20th ,May 30th 2017                                                     Submission of Final Manuscript



Zhiwei Liu

University of Electronic Science and Technology of China

Email: ziv_liu@hotmail.com



Szu-Huat Goh


Email: SzuHuat.GOH@globalfoundries.com



Yang Liu

University of Electronic Science and Technology of China

Email: yliu1975@uestc.edu.cn



Nagarajan Raghavan

Singapore University of Technology and Design

Email: nagarajan@sutd.edu.sg



 Download Call for Papers

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