Submission of Final Manuscript:May 30th,2017
Submission of Presentation Slides(for oral paper or invited talk):June 1st, 2017
Group rate for hotel reservation:850RMB (before
June 18, June 22, 2017)
The 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits ( IPFA 2017 ) is organized by the IEEE Reliability / CPMT / ED Singapore Chapter, IEEE Electron Devices Society Chengdu Chapter and the University of Electronic Science and Technology of China ( UESTC ) . The Symposium is technically co-sponsored by the IEEE Electron Device Society and IEEE Reliability Society.
IPFA 2017 will be devoted to the fundamental understanding of the physical mechanisms governing failure in a large variety of advanced semeconductor devices and the electrical - physical failure analysis techniques, methodologies and tools that could be use to reliably identify the root cause of failure in these devices.